Commit Graph

3 Commits (56835e6cc053c29bf1a15a07dbeb78f219a15214)

Author SHA1 Message Date
Eduardo Valentin 949f5a505c staging: omap-thermal: add OMAP5 data structures
This patch adds the data structures needed for proper registration
of OMAP5 chips. This patch includes definitions for these chip versions:
. OMAP5430

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-16 19:04:16 -07:00
Eduardo Valentin 1a31270e54 staging: omap-thermal: add OMAP4 data structures
This patch adds the data structures needed for proper registration
of OMAP4 chips. This patch includes definitions for these chip versions:
. OMAP4430
. OMAP4460
. OMAP4470

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-16 19:04:16 -07:00
Eduardo Valentin 8feaf0ce1a staging: OMAP4+: thermal: introduce bandgap temperature sensor
In the System Control Module, OMAP supplies a voltage reference
and a temperature sensor feature that are gathered in the band
gap voltage and temperature sensor (VBGAPTS) module. The band
gap provides current and voltage reference for its internal
circuits and other analog IP blocks. The analog-to-digital
converter (ADC) produces an output value that is proportional
to the silicon temperature.

This patch provides a platform driver which expose this feature.
It is moduled as a MFD child of the System Control Module core
MFD driver.

This driver provides only APIs to access the device properties,
like temperature, thresholds and update rate.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: J Keerthy <j-keerthy@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2012-07-16 19:02:47 -07:00